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AT&S successfully issues 175 million hybrid bond

Published: November 17, 2017; 16:15 · (Vindobona)

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, one of the globally leading manufacturers of printed circuit boards and IC substrates, has completed the issue of a subordinated bond with an indefinite term and an early redemption option after five years (hybrid bond) very successfully.

AT&S successfully issues 175 million hybrid bond / Picture: © Vindobona

The issue, which was exclusively directed at institutional investors with a minimum
subscription of EUR 100,000, was primarily placed with international investors
with the issue amount totalling EUR 175 million. The targeted transaction volume
thus significantly exceeded the first time a hybrid bond was issued by AT&S. The
coupon was determined at 4.75% due…

This article includes a total of 321 words.

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